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Distinction between good and bad iPhone mainboards

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In this video,

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we mainly identify which mainboards in the iPhone mainboards are relatively poor

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iPhones of the same series will use mainboards from different manufacturers

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Some batches of these mainboards will have some problems

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When we solder, there may be a layer break

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In iPhone 6 series,

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the mainboard produced by UMT is relatively poor,

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and the board layer is prone to disconnection during soldering

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In the 6s series,

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the main board produced by OPC is relatively poor,

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and the board layer is prone to disconnection during soldering

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In the iPhone 8 series,

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the mainboard numbered H3 K5 is the worst

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After the air gun is welded,

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it will cause a large area of 鈥嬧€媡he board to break

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Among the iPhone 8p series,

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the mainboard with batch PC-V0 produced by MRS is the worst

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After soldering, there will be multiple disconnections on the board layer

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Like the 8th generation and 8p series,

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you must pay attention when repairing,

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if you don't pay attention,

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it may cause the machine not to be turned on

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For iPhone x and above models,

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the mainboard produced by MRS is relatively poor,

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and there will be disconnection occasionally,

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but compared with the previous series,

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the probability of disconnection will be much smaller

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Next, let's go to check the rubbish mainboard of each model

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Let's take a look at the rubbish mainboard of the iPhone 6

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The 6-series rubbish mainboard is made by UMT

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It may cause the board layer to break when soldering

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Pay attention to it when repairing

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The 6s series of rubbish mainboard is made by OPC,

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and the board layer may be disconnected during welding

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Pay attention to it when repairing

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We must pay attention when repairing the iPhone 8 mainboard

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marked with the batch number H3 K5

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The blowing of the air gun will cause disconnection of the board,

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especially the audio position

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There will be about 20 disconnections

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So, Never solder the audio position

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What else positions of this mainboard cannot be welded?

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The area between the WIFI and the hard disk cannot be welded

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The side can be welded, and the lower side of the hard disk can be welded

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Rubbish mainboard for iPhone 8p

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We must pay attention when repairing the mainboard marked with the batch number PC-V0,

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otherwise it is easy to cause low current to no booting

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The disconnection position of the 8p is similar to that of the 8th generation

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They are all at the audio position,

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and about 20 wires will be broken

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There is no way to repair

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If you want to repair, you can only move the board

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Chips at the top or bottom can be soldered

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Ok, this is the end of the knowledge points

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on the distinction between good and bad iPhone motherboards