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This is an iPhone X to iPhone 11 Pro Max 6-in-1 solder fixture

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iPhone X to iPhone 11 Pro Max all use double-layer motherboard structure

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And the shape of each model is more or less different

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Therefore, we need a variety of different card positions when welding

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This is an XS Max motherboard

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We can fix it in this area as a whole

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Use the two metal buckles above to push the motherboard to the metal buckles and tighten them

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Press the red slider up at the bottom

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This will fix the motherboard

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We can now do a separation of a two-layer motherboard

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We can attach the removed single upper layer to this area

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After it is fixed, press it with the red pressure block

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Each area is marked with the corresponding model

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This position also has a slider that fixes the chip

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The chip with glue removed can be placed in this position

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Chips without glue can also be placed in this place to flatten

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This is a dual layer motherboard fixture for the iPhone series