1

00:00:05,000 --> 00:00:06,733

After removing the connector

2

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Next, we will start to clean up the residual solder on the solder joints on the motherboard

3

00:00:19,700 --> 00:00:20,966

Add some flux

4

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And get some low temperature solder

5

00:00:38,566 --> 00:00:42,200

Do not apply the low temperature solder directly to the motherboard

6

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Otherwise the solder debris will be all over the place

7

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After applying, use a soldering iron to iron it

8

00:01:02,600 --> 00:01:06,033

Stick some low temperature solder to the tip of the soldering iron

9

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Then let's flatten the solder joint

10

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For this big joint

11

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The soldering iron stays a little longer

12

00:01:25,766 --> 00:01:27,666

Small joint just go by

13

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We only flatten our left side

14

00:01:35,966 --> 00:01:41,966

The soldering iron and the motherboard seem to be in contact, just use solder to touch the motherboard

15

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Then turn the direction of the motherboard

16

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Continue to flatten the left side

17

00:02:07,700 --> 00:02:09,933

Some pins are not easy to melt

18

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Just flatten for a few more times

19

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Why flatten low temperature solder?

20

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Because the original solder on the motherboard is high temperature solder

21

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It is difficult to melt directly to clean up

22

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After flatten the low temperature tin once, the original high temperature solder melting point is reduced

23

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This will make it easier for us to clean up the solder

24

00:02:49,600 --> 00:02:52,733

This is the main purpose of flattening low temperature solder