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Today we learn how to deal with these residual solder on the motherboard

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First, take a small lump of low-temperature tin from the bottle of low-temperature tin paste

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Put it on the motherboard fixture

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Try not to apply this low temperature tin directly to the motherboard

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If it is applied to the motherboard, it will easily flow into the gaps of the surrounding components when it is melted

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Let's apply it to the fixture first

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Clean the tip of the soldering iron

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Use the tip of a soldering iron to iron this low temperature tin

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Put a lot of this low temperature tin on the tip of the soldering iron

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Then apply it on the motherboard like this

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In this way, the solder will not flow to the surrounding

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After the low melt solder is applied to the motherboard

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This solder doesn't want to go with the soldering iron

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And many of the solder that have been applied are stuck togethe

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At this time, we add a little bit of flux

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Not too much

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Now let's apply

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When smearing, be sure to pay attention to these low-temperature tin on the soldering iron because the amount is relatively large

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Be careful not to stick to the surrounding components

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During the applying process, we need to turn this motherboard fixture

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We've smeared the solder under the chip

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Then let's do another one

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This is the low melt solder smear operation we did before dealing with the solder joints

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Why do we need to smear the low melt solder?

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Because the solder used in the production process of the motherboard is high melt solder

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After we removed the chip, the solder remaining on the motherboard will be uneven

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Then there is no way to install the chip.

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Because some joints don't even have solder on them

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We need to reball the back of the chip before we solder it back

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Or the new chip bought back has already been reballed

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When soldering, there is solder on the chip and the motherboard

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If they are welded together, there must be some places that stick and some places that won't stick

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The place where it is sticked may be short-circuited because of the tin

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So we must flatten it as much as possible

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If we do not use low melt solder to neutralize in the process of applying solder

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Then we directly flatten the high melt solder, it is difficult to melt

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So we must apply the low melt solder first