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48. Chip reballing method 1
This video focuses on the Chip reballing method.
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Use curved tweezers to stabilize the stencil

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Must be curved tweezers

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The contact surface of the straight tweezers is too small

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For example, if we press this area on the left, the right side will easily lift up

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When pressing the right side, the left side is easy to lift up

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And because of the small contact area, the stencil is easy to move

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So we use the curved legs of the curved tweezers, all pressed onto the stencil

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It will be more stable

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Flattened the stencil

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When tinning with the blade, keep the blade 2-3mm away from the solder balls in the first row on the far left

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Push the blade down and flatten it back

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In this way, most of the solder on the top has been flattened

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Then turn the blade back

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Flatten it on the bottom

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So the solder has been flattened

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If the size is small enough, some chips will be flattened once

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Then shovel off the excess solder

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After shoveling

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Wipe off excess with a dust-free cloth

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We use rotary-air hot gun

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The temperature is about 230 degrees

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Air volume to level 3 or 4

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Blow the solder

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Sweep blowing on a large area first

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Such an area about 5 cm in diameter

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Heating the surrounding area

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In this way, the stencil is not easily deformed

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Blow for about a minute

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Stop the nozzle to a corner of the chip to blow the solder

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Don't rush to loosen the tweezers after the solder melts

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Wait 5-10 seconds for the solder to solidify

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Release the tweezers

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Bending steel stencil

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Pick the chip from the back

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Reballing is done

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