1
00:00:03,000 --> 00:00:04,600
Now we clean the motherboard
2
00:00:07,233 --> 00:00:12,166
After flattening the solder on the motherboard, don't rush to clean the soldering oil
3
00:00:12,400 --> 00:00:19,000
Because the solder joint is directly exposed to the air, it is very easy to blacken and oxidize
4
00:00:19,366 --> 00:00:26,333
Now there is a thin layer of flux on the surface of the solder joint, but the solder joint is not easy to oxidize
5
00:00:26,733 --> 00:00:30,300
So we clean the dirt on the solder joints when we are ready to solder
6
00:00:30,300 --> 00:00:32,200
Now the chip has been reballed
7
00:00:32,433 --> 00:00:33,833
We're ready to solder back
8
00:00:34,133 --> 00:00:35,533
Start cleaning now
9
00:00:35,733 --> 00:00:37,766
Put a dust-free cloth on it
10
00:00:38,433 --> 00:00:40,533
Wash with a dust-free cloth
11
00:00:45,266 --> 00:00:48,533
The surrounding area of the solder joint must be cleaned
12
00:00:48,900 --> 00:00:53,933
Prevent some dirty things from remaining that cause individual pins to not to stick
13
00:00:55,666 --> 00:00:57,800
After cleaning we are ready to solder
14
00:00:58,466 --> 00:01:01,400
Blows the motherboard a little with the hot air gun
15
00:01:02,066 --> 00:01:03,666
Make the surface heated
16
00:01:04,366 --> 00:01:06,433
Then add a bit of flux in the middle
17
00:01:08,033 --> 00:01:09,400
Spread a thin layer
18
00:01:10,033 --> 00:01:11,166
The thinner the better
19
00:01:11,566 --> 00:01:14,433
As long as there is flux on each solder joint
20
00:01:14,666 --> 00:01:15,766
The thinner the better
21
00:01:15,900 --> 00:01:17,133
Don't add too much
22
00:01:18,466 --> 00:01:21,100
Because after the chip is soldered to the motherboard
23
00:01:21,333 --> 00:01:24,500
When we clean, we can only wash the surrounding flux
24
00:01:24,600 --> 00:01:26,866
The bottom of the chip is not washable
25
00:01:27,033 --> 00:01:28,400
So don't put too much
26
00:01:29,333 --> 00:01:31,266
After the solder paste is applied
27
00:01:31,400 --> 00:01:33,066
We start putting the chips back
28
00:01:33,433 --> 00:01:37,733
When placing the chip, we should pay attention to the position of pin 1
29
00:01:38,266 --> 00:01:41,533
This position is aligned with the direction of the mark
30
00:01:42,600 --> 00:01:44,200
Determine the direction first
31
00:01:44,400 --> 00:01:45,866
Then determine the location
32
00:01:46,033 --> 00:01:47,533
For example, put up
33
00:01:47,600 --> 00:01:51,066
Capacitors are completely stuck, definitely not okay
34
00:01:51,300 --> 00:01:54,666
The capacitor on the right stuck,definitely not okay either
35
00:01:54,933 --> 00:01:56,000
Leave a little gap
36
00:01:56,566 --> 00:01:58,666
Then push the right side a little bit
37
00:01:58,866 --> 00:02:00,066
Leave a little gap
38
00:02:00,466 --> 00:02:01,466
Now it's okay
39
00:02:01,933 --> 00:02:03,933
It doesn't need to be very precise
40
00:02:04,300 --> 00:02:07,100
Just about it, don't slant too much
41
00:02:07,400 --> 00:02:09,366
Still using a straight-air gun
42
00:02:09,766 --> 00:02:15,300
The temperature is still 450 degrees and the air volume is adjusted to the minimum
43
00:02:16,066 --> 00:02:17,300
Then we start welding
44
00:02:18,200 --> 00:02:22,666
After the temperature reaches 450, the air gun points to the chip
45
00:02:22,966 --> 00:02:28,566
Note that the chip will have a slight homing motion during the melting process. Look carefully
46
00:02:32,533 --> 00:02:33,666
Moved a little bit
47
00:02:34,333 --> 00:02:35,700
Now it's welded
48
00:02:40,333 --> 00:02:41,633
Let's weld another one
49
00:02:46,266 --> 00:02:48,966
I didn't make a special mark on this chip just now
50
00:02:49,533 --> 00:02:52,133
The reason is because after the chip is removed
51
00:02:52,233 --> 00:02:57,800
I found that the surface of the chip has a little bit of pinch marks from when we disassembled it
52
00:02:59,566 --> 00:03:00,433
Like this mark
53
00:03:02,366 --> 00:03:04,133
There's a little dirty stuff on it
54
00:03:04,200 --> 00:03:05,200
Let's clean it again
55
00:03:12,133 --> 00:03:13,066
This position
56
00:03:15,000 --> 00:03:19,833
This is how the tweezers went from this direction when it was just disassembled
57
00:03:20,033 --> 00:03:21,700
A little bit of this pinch mark
58
00:03:21,866 --> 00:03:26,766
At this time, we will align this position to the right side of the current direction
59
00:03:27,833 --> 00:03:30,800
We just took the chip from here and took it off
60
00:03:31,466 --> 00:03:35,533
If you can see clearly marked places, you don't need to mark them
61
00:03:37,266 --> 00:03:40,500
The position of this chip is slightly tilted by me
62
00:03:40,900 --> 00:03:43,766
For example, the left side we see now
63
00:03:44,033 --> 00:03:46,333
The above part is slightly to the right
64
00:03:46,833 --> 00:03:49,000
The lower part is slightly to the left
65
00:03:49,066 --> 00:03:53,500
A slight movement will be noticeable as the solder melts. Look carefully
66
00:03:54,000 --> 00:03:56,533
The air gun is still 450 degrees
67
00:03:56,700 --> 00:03:58,033
Minimum air volume
68
00:03:58,533 --> 00:04:02,666
After the temperature reaches 450, we start blowing chips
69
00:04:03,400 --> 00:04:04,200
Don't rush
70
00:04:05,200 --> 00:04:08,200
Now the temperature is good and let's start blowing
71
00:04:09,733 --> 00:04:12,666
This kind of small chip blows at a fixed point
72
00:04:12,766 --> 00:04:16,100
There's no need to sweep the nozzle back and forth like this
73
00:04:16,400 --> 00:04:19,066
Now it's obvious that the chip is moving
74
00:04:19,766 --> 00:04:21,800
OK, the chip is soldered
75
00:04:21,966 --> 00:04:24,866
Now let's look at this position on the left
76
00:04:25,166 --> 00:04:29,800
Are the upper and lower sides of the gap at the same distance from the components now?
77
00:04:30,433 --> 00:04:31,800
It means it's welded