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Hello,everyone

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Today, I will show you the welding of small components on the mobile phone motherboard

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The small components on the mobile phone motherboard include resistors, capacitors, inductors,diodes and some FETs

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Fuses and inductors are most often damaged

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The probability of damage to other components is very small

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But no matter what component it is

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When repairing, the welding method is basically the same

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When welding small-sized components, the most difficult thing is the size we can see on the picture

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The smallest one,like this one

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Its size is 01005

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This is a standard size nominal for an electronic component

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01005 is in inches

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01 is 0.01 inches

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005 is 0.005 inches

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When converting to millimeters

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The size of 01005 is basically 0.3mm in length

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Then the width is 0.15mm

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It's a very small size

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Smaller than sesame

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So the welding of this component is very difficult

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Next, I will demonstrate the disassembly and assembly of this component

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First, let's remove this component from the motherboard

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When disassembling components, the more dense the components, the greater the difficulty

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A single one in a relatively open area will be much less difficult

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Like this one

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When a row like this,they are very close, it will be more difficult

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Let's find a more difficult position to operate

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In the process of disassembling damaged components, try not to touch the surrounding components crookedly

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So we need to have a good feel for this disassembly

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Straight-air hot gun

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Temperature for 450 degrees

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Maximum air volume

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Then when using sharp tweezers to clamp the components, do not clamp the upper and lower sides

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In this case, it is easy to touch the surrounding components

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So we must clip diagonally

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Put a leg in its lower left corner

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A leg on the upper right corner

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Clamp diagonally like this

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Then the air gun blows while twisting the tweezers

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You don't need to blow it all the time

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Blow it a bit and then remove it immediately

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Now the component is removed