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Removing the chip needs to be done on the desktop

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It is not recommended to disassemble under the microscope

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Because if you disassemble it under a microscope,

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There is no way for the air gun to stand vertically

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The temperature blown out will have some deviations

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Especially to newbies

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If the angle is not right

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when blowing with a hot air gun

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Looks like it was blown onto the chip under the microscope

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It's possible that it actually blows somewhere else

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For example, now it is blowing to the chip from this position

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What you see is that this area is heated

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The actual heating area is probably in this area

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Because it has a certain inclination

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Therefore, if you are a newbie, don't disassemble it under the microscope

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Even if an old hand disassembles it under the microscope, the temperature may deviate

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Because I need to show you the operation

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Only by operating under the microscope,you can see every detail clearly

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So you can see that I'm working under a microscope

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Next, we start to disassemble

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First, adjust the motherboard to a direction that is easier for us to operate

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Then we choose the position where we start to operate

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The corner of this area

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The area in the upper right corner is relatively empty

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There are no components, you can go down from this position

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You can also start from this area in the middle

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But don't poke too deep

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When it reaches this position, the blade squeezes the capacitors on both sides

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It is possible to loosen them

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So try not to choose to operate from this position

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Then the lower right corner is also relatively empty

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This position can also be dismantled

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But the CPU of this motherboard is behind this area

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When we first start disassembling the chip, it will be time consuming

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So we recommend choosing an area that is farther away from the CPU

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For example, the area in the upper right corner

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It will be farther away from this CPU

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I'm putting the board upside down now

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This is the lower part, this is the upper part

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This is an XR motherboard

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We blow the side away from the CPU with the hot air gun

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Let's keep blowing on this corner first

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After the blade is placed on the motherboard, press the back slightly

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This way, let the knife go straight inward

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Don't stand diagonally like this and poke in like this

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It is easy to poke the motherboard

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Flatten down a little

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Try it around gently

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Now the glue on the edges is starting to soften

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Soft but does not mean the solder has been melted

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We'll be able to poke a little deeper into it later, that means the tin is starting to melt

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It's still hard now

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Still can't poke the solder and it hasn't melted

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Now it's loose enough to poke in

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It means that the solder on this side has begun to melt

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Then we blow to other areas on a large scale

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Slowly twist the handle to pry the chip up

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Don't use too much force

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The hard disk chips from Iphone 8 to Iphone 13,

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the outermost edge is all ground pins

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The melting speed will be slightly slower

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It's easy to break off the pad when you pry too hard

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Twist the handle to pry the chip

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It doesn't matter if the pad breaks off on the side

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Blow around the edge

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We have removed this chip

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Let's look at the pads

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Luckily no break off

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This temperature is relatively suitable

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After removing it, we can find that most of the pads are relatively flat on the surface

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Individual pads show signs of melting

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This is normal

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If after removing, all the pads are in this state of melting

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It means that you did not operate properly during the prying process

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The solder has softened

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And then you still heat up

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If it is heated for a long time, the solder of chip will be extruded

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Like Xr board

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Behind its hard drive is just a wifi chip

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There are also some other chips like USB

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If you blow for too long, the solder of the area behind may be extruded

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Relatively speaking, when removing the hard disk of the Xr motherboard, the temperature is not so easy to control

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If the control is not good, there may be solder extrusion around