1

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Next, let's clean up the residual solder of the motherboard pads and the pads of the chip

2

00:00:11,100 --> 00:00:12,233

Put some flux

3

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You can put it a bit more

4

00:00:15,066 --> 00:00:17,400

Because the size of the chip is kinda big

5

00:00:19,066 --> 00:00:21,666

Then put the desoldering wick on this motherboard

6

00:00:23,000 --> 00:00:24,533

Flatten the remaining solder

7

00:00:25,966 --> 00:00:27,766

We just cleaned it with a knife

8

00:00:28,100 --> 00:00:30,233

There is less solder remaining on it

9

00:00:30,966 --> 00:00:32,033

Easier to flatten

10

00:00:39,333 --> 00:00:40,800

The motherboard almost done

11

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Next let's clean up the chip

12

00:00:48,333 --> 00:00:50,266

There is basically no solder on the chip

13

00:00:50,866 --> 00:00:52,500

Just a little bit on the corner

14

00:00:56,766 --> 00:01:00,566

There is a pad on this corner, it may be a little loose when prying

15

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It's off now

16

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But that doesn't matter

17

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I already said it when I started

18

00:01:09,366 --> 00:01:12,566

This 110-pin hard drive after Iphone 8

19

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The pins of the edge are all grounded

20

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It doesn't matter if one or two miss

21

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No need to fix

22

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If the middle pad is off

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Like the second or third row

24

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We need to go to the drawing and check

25

00:01:30,966 --> 00:01:32,966

See if this pin is useful or not

26

00:01:33,633 --> 00:01:35,366

You don't have to worry about the edge

27

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It is clearly seen

28

00:01:38,900 --> 00:01:41,933

It is connected to the large copper foil on both sides

29

00:01:44,966 --> 00:01:46,000

Let's clean a little

30

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Now there is a little soldering oil, so we can't see it clearly

31

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Clean wouldn't help at all

32

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Gotta apply some soldering oil

33

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Now we can see

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This pad is connected to the large copper foil on this side.

35

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So it doesn't matter if you don't fix it if this pad is off

36

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After the chip and motherboard have been flattened

37

00:02:11,866 --> 00:02:14,533

Next, wash off the soldering oil

38

00:02:24,033 --> 00:02:26,366

This chip from Samsung is matte

39

00:02:29,466 --> 00:02:32,100

After cleaning, we can't see the wiring

40

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Let's put the chip here

41

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We don't need to clean the motherboard until we are ready to weld

42

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Because there is a thin layer of flux on the surface of the pads of the motherboard

43

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So the pads don't touch the air

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They are not easy to oxidize and blacken

45

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We have flatten the low melt solder pads

46

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Once it touches the air

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It'll get oxidized and blackened very easily

48

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We'll clean it when we're ready to install the chip

49

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No need to clean it now