1

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Now we start to reball

2

00:00:09,066 --> 00:00:11,000

Stencil after iPhone 8

3

00:00:11,533 --> 00:00:14,000

This area of the hard disk is universal

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00:00:14,600 --> 00:00:15,900

Any model can be used

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When reballing small chips, after the solder is applied, it should be shoveled towards the front

6

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This hard drive is too big, so don't shovel it

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If you shovel,half of the solder that will be shoveled out from some of the pads

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So don't shovel it

9

00:00:41,033 --> 00:00:44,833

After applying, just put the blade at a larger angle.

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Flatten back

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Flatten away the excess

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Don't wipe it either

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00:00:54,233 --> 00:00:55,866

It will wipe out a lot

14

00:00:57,166 --> 00:00:59,533

Then use 230 degrees to reball

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Swing the hot air gun slightly faster

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Because the opening of the hard disk is larger

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And they are all in the middle of the stencil

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When your blowing temperature is too high or the speed is very slow,

19

00:01:16,733 --> 00:01:20,200

it is easy to blow the stencil to deform and distort it

20

00:01:22,933 --> 00:01:24,900

Swing the hot air gun quickly

21

00:01:30,733 --> 00:01:34,500

Do it for about a minute and then blow the solder at a fixed point

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We didn't fix the upper left corner pad because it's grounded

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It doesn't stick and it's normal

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00:01:53,666 --> 00:01:55,833

Okay, we've done reballing

25

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Then take this thing off the side

26

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In this way, the reballing will be fuller

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00:02:08,900 --> 00:02:09,900

And also even

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00:02:10,566 --> 00:02:12,233

If it is shoveled or wiped,

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00:02:12,833 --> 00:02:14,866

The pads may be uneven in size

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Then at this time, we can see that there is some glue on the corners of the chip that has not been removed

31

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Take a blade and cut it off to prevent it from touching the surrounding components while we install it

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Now it's clean