1

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After the glue on the chip and the motherboard has basically been scraped off

2

00:00:07,766 --> 00:00:10,466

Next, we start to layer the CPU chip

3

00:00:11,700 --> 00:00:13,633

First we stand up the chip

4

00:00:15,366 --> 00:00:17,000

Check the structure of the chip

5

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Although it's a little dirty

6

00:00:19,466 --> 00:00:26,733

But we can still clearly see that this CPU chip is divided into two layers: the upper layer and the lower layer

7

00:00:26,900 --> 00:00:31,566

We use a blade to cut at a corner of the gap between the upper and lower layers

8

00:00:39,266 --> 00:00:40,366

No need to cut deep

9

00:00:40,533 --> 00:00:42,666

Just cut a small gap like this

10

00:00:43,333 --> 00:00:45,233

The next step is to layer

11

00:00:50,066 --> 00:00:53,466

Put the chip on the slot that is specially stuck to the chip

12

00:00:55,033 --> 00:00:58,166

This corner is the upper right corner we just cut

13

00:01:00,233 --> 00:01:02,933

We are going to cut from this position to layer it

14

00:01:07,433 --> 00:01:13,800

For layering,we're gonna use a rotary-air hot gun,the temperature to about 280 degrees

15

00:01:14,333 --> 00:01:17,000

The air volume is still level 3-4

16

00:01:17,933 --> 00:01:19,933

We heat the edge of the CPU

17

00:01:29,266 --> 00:01:30,733

Blow the edge in a circle

18

00:01:36,433 --> 00:01:45,066

While blowing, use the CPU prying knife to slowly and tentatively cut inward from the position of the small gap just now

19

00:01:46,033 --> 00:01:48,700

It wouldn't get heated so fast at the beginning

20

00:01:49,066 --> 00:01:53,933

Blow it a little for about 20 seconds, then start to slowly cut inwards

21

00:01:57,766 --> 00:01:59,366

Well,it's in now

22

00:02:00,200 --> 00:02:03,366

Be sure to blow evenly so is the temperature

23

00:02:03,700 --> 00:02:05,200

The edges must be heated

24

00:02:07,100 --> 00:02:10,333

So the upper and lower layes have been separated

25

00:02:15,533 --> 00:02:18,266

Then we need to flatten the upper and lower layers

26

00:02:23,533 --> 00:02:26,200

Get a little low melt solder with tweezers

27

00:02:32,433 --> 00:02:35,700

Use a soldering iron to flatten the pads around the edge

28

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During this process

29

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Try not to touch the reflective glass crystal in the middle

30

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Gently flatten the surface without pressing

31

00:03:04,566 --> 00:03:07,566

The middle layer is a material similar to plastic

32

00:03:08,633 --> 00:03:13,866

If the soldering iron is pressed a little harder, the middle layer will be useless

33

00:03:14,500 --> 00:03:16,633

There's no way it can work anymore

34

00:03:23,966 --> 00:03:25,966

Let's flatten the top cover now

35

00:03:29,766 --> 00:03:30,833

It's flat

36

00:03:30,833 --> 00:03:33,266

Nothing different from the ordinary chips

37

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Just dip it in low melt solder and flatten it

38

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Try not to stay for too long

39

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Because it may burn