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85. Cleaning&flattening the solder on the mid layer
In the video, we will learn to cleaning&flattening the solder on the mid layer.
Detail
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After scraping, we clean the chip

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Brush with PCB cleaner

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Check out this place

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The hole in the middle layer is similar to the honeycomb

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Very regular

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Clean out the yellow dirty glue residue in the honeycomb holes

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Brush gently

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Don't use too much force

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After most of the glue residue has been cleaned

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Next, we need to flatten the solder again

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Because this position has just been flattened and scraped, there is still a lot of solder in some pads

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For example, the area in the upper left corner that we see now

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It's still flat at these points

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These spots are full of solder

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It has more solder than the next step to reball

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So gotta flatten the solder a little bit

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Be sure to remember that the steps are to clean first and then flatten the solder

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Low melt solder of course

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Just flatten like this

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This point is obviously smaller

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After the solder was flattened, it was found that there was an idle pad in the area below the chip stuck into the hole

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We need to deal with this idle pad

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It is best to use a straight-air gun to heat this copper color place

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The heating area of the straight-air gun is small and the temperature rises quickly

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We choose a sharp blade

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Then pick from the side with the tip of the knife

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Blow the solder and take it out

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Check other position

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There was one at this location just now

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This should have been flattened out when flatten

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No more big pads

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No more idle pads

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Next, let's start cleaning the chip

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Ready to reball this mid layer

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