1
00:00:03,000 --> 00:00:05,266
After scraping, we clean the chip
2
00:00:09,133 --> 00:00:10,800
Brush with PCB cleaner
3
00:00:11,866 --> 00:00:13,266
Check out this place
4
00:00:14,400 --> 00:00:17,400
The hole in the middle layer is similar to the honeycomb
5
00:00:18,733 --> 00:00:19,866
Very regular
6
00:00:22,666 --> 00:00:26,100
Clean out the yellow dirty glue residue in the honeycomb holes
7
00:00:29,533 --> 00:00:30,600
Brush gently
8
00:00:31,000 --> 00:00:32,600
Don't use too much force
9
00:00:56,566 --> 00:00:59,300
After most of the glue residue has been cleaned
10
00:01:00,100 --> 00:01:02,500
Next, we need to flatten the solder again
11
00:01:04,033 --> 00:01:10,200
Because this position has just been flattened and scraped, there is still a lot of solder in some pads
12
00:01:11,000 --> 00:01:15,266
For example, the area in the upper left corner that we see now
13
00:01:15,933 --> 00:01:18,133
It's still flat at these points
14
00:01:22,600 --> 00:01:24,266
These spots are full of solder
15
00:01:26,800 --> 00:01:29,600
It has more solder than the next step to reball
16
00:01:30,900 --> 00:01:33,033
So gotta flatten the solder a little bit
17
00:01:36,533 --> 00:01:41,633
Be sure to remember that the steps are to clean first and then flatten the solder
18
00:01:42,766 --> 00:01:44,433
Low melt solder of course
19
00:01:58,066 --> 00:01:59,666
Just flatten like this
20
00:02:00,200 --> 00:02:02,533
This point is obviously smaller
21
00:02:19,300 --> 00:02:26,700
After the solder was flattened, it was found that there was an idle pad in the area below the chip stuck into the hole
22
00:02:28,900 --> 00:02:30,633
We need to deal with this idle pad
23
00:02:31,500 --> 00:02:35,366
It is best to use a straight-air gun to heat this copper color place
24
00:02:39,333 --> 00:02:44,066
The heating area of the straight-air gun is small and the temperature rises quickly
25
00:02:44,400 --> 00:02:45,900
We choose a sharp blade
26
00:02:49,100 --> 00:02:51,666
Then pick from the side with the tip of the knife
27
00:02:51,833 --> 00:02:53,700
Blow the solder and take it out
28
00:02:57,200 --> 00:02:58,433
Check other position
29
00:02:58,466 --> 00:03:00,733
There was one at this location just now
30
00:03:01,033 --> 00:03:03,633
This should have been flattened out when flatten
31
00:03:08,933 --> 00:03:10,233
No more big pads
32
00:03:10,600 --> 00:03:11,833
No more idle pads
33
00:03:12,900 --> 00:03:15,066
Next, let's start cleaning the chip
34
00:03:15,633 --> 00:03:17,533
Ready to reball this mid layer