1
00:00:06,466 --> 00:00:07,800
Completely cleaned up
2
00:00:08,866 --> 00:00:13,333
Next, we will fill in the pits of the middle layer and protrude them out
3
00:00:14,666 --> 00:00:20,133
Otherwise, after reballing the cover, it cannot be touched when it is directly installed
4
00:00:20,333 --> 00:00:24,033
I'm going to fill each of these pads to be level with the surface
5
00:00:24,733 --> 00:00:26,733
Medium melt solder as reballing
6
00:00:28,166 --> 00:00:32,700
As for the knife,also uses the kind of blade we use for reballing
7
00:00:33,500 --> 00:00:36,066
Press the tweezers onto the chip to fix it
8
00:00:36,833 --> 00:00:39,633
Prevent it from moving around while appling the solder
9
00:00:40,433 --> 00:00:41,866
'Cause we've flattened the back
10
00:00:45,866 --> 00:00:47,766
If we apply the solder to this side
11
00:00:48,200 --> 00:00:52,833
When the chip moves to the right and sticks to the bottom,it's a waste of effort
12
00:00:53,400 --> 00:00:57,400
Take a pair of tweezers and press gently, don't press too hard
13
00:00:58,100 --> 00:00:59,566
The crystal will be crushed
14
00:01:11,700 --> 00:01:15,933
After each hole is smeared with solder, then you can pick up the chip
15
00:01:21,500 --> 00:01:22,400
Don't shift
16
00:01:23,566 --> 00:01:27,700
After picking it up, clean up the solder paste in this area
17
00:01:32,633 --> 00:01:33,900
Then put the chip back
18
00:01:39,766 --> 00:01:43,133
Gently tap the middle to make it stick to the silicone pad
19
00:01:44,866 --> 00:01:48,733
Find a new clean dust-free cloth to cover the surface of the chip
20
00:01:52,666 --> 00:01:59,200
Then use your finger to press a corner of the chip and pull the dust-free cloth to wipe it flat from the surface
21
00:02:05,833 --> 00:02:11,633
In this way, the excess solder paste on the surface will be removed by the dust-free cloth
22
00:02:12,033 --> 00:02:15,466
The solder paste in each hole is relatively uniform now
23
00:02:16,833 --> 00:02:18,600
After we fill the solder paste
24
00:02:19,433 --> 00:02:20,400
Pick up the chip
25
00:02:21,033 --> 00:02:26,700
Just now I pressed it tightly, and we need to pick it up a little with tweezers from the bottom
26
00:02:27,366 --> 00:02:28,533
Find a tissue
27
00:02:29,200 --> 00:02:30,233
Put it on it
28
00:02:35,600 --> 00:02:38,600
Rotary-air gun to about 230 degrees
29
00:02:39,266 --> 00:02:40,900
It's the temperature of reballing
30
00:02:41,933 --> 00:02:43,933
Level 3-4 air volume
31
00:02:45,233 --> 00:02:47,400
Use tweezers to gently press the chip
32
00:02:47,566 --> 00:02:50,200
Because there is excess solder paste around the chip
33
00:02:50,366 --> 00:02:58,300
When we blow the solder, the solder paste on the edge may drill into the gap between the tissue and the bottom of the chip and stick to the back of the chip
34
00:02:58,600 --> 00:03:01,766
So we gotta take a pair of tweezers and gently press the middle
35
00:03:02,066 --> 00:03:03,133
Then blow the solder
36
00:03:09,400 --> 00:03:13,433
In this way, the middle layer of reballing is completed
37
00:03:14,166 --> 00:03:16,233
Each pad is now evenly sized
38
00:03:17,300 --> 00:03:22,700
Then you can stand the chip sideways to see if there are any individual pads that protrude a lot
39
00:03:25,866 --> 00:03:30,900
Reballing in this way can never be compared with the uniformity of stencil reballing
40
00:03:31,400 --> 00:03:33,800
But try to reball as evenly as possible
41
00:03:33,800 --> 00:03:37,433
Because there is no way to use stencil to reball in this position
42
00:03:37,566 --> 00:03:39,133
It's not a flat plane
43
00:03:39,366 --> 00:03:41,766
So it can only be reballed in this way
44
00:03:41,933 --> 00:03:43,933
We try to keep the size consistent
45
00:03:44,300 --> 00:03:46,133
Just wipe it with a cloth
46
00:03:48,500 --> 00:03:50,166
Don't do it back and forth
47
00:03:50,366 --> 00:03:53,933
The more times you wipe, the more uneven the solder will be
48
00:03:56,966 --> 00:03:59,066
We call it honeycomb hole reballing
