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Now the chip is clean

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Then we will start to use a special tool to reball it

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Now let's see the step

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This is called CPU reballing platform

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Now A8 has been divided into upper and lower layers

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A special gasket like this should be placed under it

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Just like this

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It is to replace the thickness of the upper or lower layer

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This stainless steel sheet

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This tool has the label 8901234 on it

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Then there is also a corresponding 8901234 here

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A8 CPU, the two corners correspond to the position of 8

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Place just like this

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Then use our dedicated stencil

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We gotta clean the stencil as well

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To prevent some dirt in the hole

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Then put the stencil on the card slot

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As soon as you put on it, the pads in the middle will automatically correspond

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May be slightly tilted

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This will not affect reballing

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After putting it on

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There's a big magnet on the base

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Then the above is the template for stucking chip

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As long as you put it on, the magnet will suck the stencil very tightly

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Basically, it won't move during this process

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It is much more stable than the manual reballing

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And the stencil alignment is also very simple

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There is a magnet in the middle of the stencil to stuck it

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You don't have to use tweezers to press it, it won't hang in the air

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This tool is very suitable for beginners to practice

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Reballing on the CPU without the guidance of others, it may not be successful if you practice for a week or two

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With this tool, even a beginner can get it done in half a day at most

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All solder is smoothed and shoveled

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So much easier than manual tools

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Wipe off the excess

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Don't worry about the stencil shifting

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Then we start blowing

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Because there will be some heat dissipation on this base

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We need to increase the temperature of reballing a little bit

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Around 250 degrees

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The air volume is still level 3-4

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Blow a large area for about 1 minute first

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Then slowly blow the solder to a corner

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At this time, individual pads may be a little dirty or the position of the stencil may be slightly off

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There is no need to remove the stencil even if the individual pads are not glued on

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Put a little solder oil at this position

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There are 2 pads off here

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Add a little bit of solder oil to them and blow it with an air gun

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Gently touch it with tweezers

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Let it return to the position of the pad

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Push a bit

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It's glued

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In this way you don't have to take the stencil off and reball it

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Chip reballing is done

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Pick up this stencil

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Still the same way

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See if there is any excess solder bead in this hole

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Looking at it from the side, it is obvious that there is nothing

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Done