1

00:00:03,000 --> 00:00:06,166

There is no place for reference when placing chips

2

00:00:06,533 --> 00:00:09,966

Like many laptop motherboards or desktop motherboards

3

00:00:10,300 --> 00:00:15,500

After many chips are removed, a white box will be drawn on the edge for reference

4

00:00:16,733 --> 00:00:20,300

There is no such box on the mobile phone to identify it

5

00:00:20,833 --> 00:00:23,433

We can only refer to the surrounding components

6

00:00:24,633 --> 00:00:26,566

Do not misplace pin 1

7

00:00:29,733 --> 00:00:32,266

Pin 1 is to the direction of the flash

8

00:00:32,966 --> 00:00:35,300

We can see this label on the front crystal

9

00:00:35,833 --> 00:00:39,100

On the back, you can actually see it on this corner

10

00:00:39,666 --> 00:00:40,700

Let's take a look

11

00:00:42,533 --> 00:00:46,366

There is a small golden triangle that can be vaguely seen here

12

00:00:48,133 --> 00:00:49,933

This is the mark of pin 1

13

00:00:50,366 --> 00:00:51,233

We put it here

14

00:00:51,633 --> 00:00:54,533

It wouldn't get reversed to the direction to the flash

15

00:00:55,933 --> 00:00:59,766

Then the surrounding situation should refer to the surrounding components

16

00:01:01,266 --> 00:01:04,233

Note the size of the gap before removing it

17

00:01:04,233 --> 00:01:08,733

Or find a board of the same model as a reference for comparison

18

00:01:09,566 --> 00:01:11,033

Pretty much this position

19

00:01:12,666 --> 00:01:14,733

Start heating after placing

20

00:01:16,500 --> 00:01:22,033

When soldering chips such as CPU, it is not recommended to solder under the microscope

21

00:01:22,500 --> 00:01:25,033

Because the size of the chip is very large

22

00:01:25,100 --> 00:01:28,533

The temperature may be uneven when blowing under the microscope

23

00:01:28,966 --> 00:01:30,600

We recommend soldering without it

24

00:01:30,833 --> 00:01:33,266

But now I'm demonstrating to you guys

25

00:01:33,533 --> 00:01:35,766

so I need to do it under the microscope

26

00:01:36,066 --> 00:01:39,966

If we weld normally, we can turn on the flash of the mobile phone

27

00:01:40,266 --> 00:01:41,966

Then shine to this side gap

28

00:01:44,233 --> 00:01:46,700

This is the gap between the chip and the motherboard

29

00:01:47,700 --> 00:01:49,600

We can't see it from this position

30

00:01:50,233 --> 00:01:51,533

I got some other board

31

00:01:52,133 --> 00:01:53,833

We mainly see this position

32

00:01:55,333 --> 00:01:57,700

Look at the gap between the chip and the motherboard

33

00:01:59,700 --> 00:02:01,733

You can sit lower and see this gap

34

00:02:03,666 --> 00:02:06,666

This is an undisassembled chip with glue in it

35

00:02:06,800 --> 00:02:10,433

Solder beads can be seen in the chip that has been disassembled

36

00:02:10,800 --> 00:02:13,033

I can take this chip off and take a look

37

00:02:15,466 --> 00:02:17,500

We can see the solder beads clearly

38

00:02:18,433 --> 00:02:21,633

Then we see the process of the collapse of the solder bead

39

00:02:22,933 --> 00:02:27,166

As soon as we can see this whole chip collapsing we stop the heat

40

00:02:32,300 --> 00:02:37,533

Because I need to demonstrate it for everyone to see, so I operate it under the microscope

41

00:02:38,366 --> 00:02:42,633

Because there is soldering oil underneath, it doesn't slant too much

42

00:02:43,566 --> 00:02:45,033

Then we continue to blow

43

00:02:46,633 --> 00:02:50,833

The temperature of the air gun is the same as and the hard disk installation

44

00:02:51,433 --> 00:02:53,766

280-300 degrees

45

00:02:54,100 --> 00:02:56,166

Air volumn level 3-4

46

00:02:58,133 --> 00:03:00,033

Heat evenly around the circle

47

00:03:03,533 --> 00:03:06,966

For the upper and lower positions, blow a little more

48

00:03:08,133 --> 00:03:09,866

The same as when removing the chip

49

00:03:11,100 --> 00:03:14,633

Up and down, the PCB will spread the temperature away

50

00:03:19,466 --> 00:03:21,066

Take a closer look at the chip

51

00:03:21,400 --> 00:03:24,333

Later,there may be a slight homing action

52

00:03:24,666 --> 00:03:28,833

Now I blow at a fixed position to prevent this nozzle from blocking the view

53

00:03:28,966 --> 00:03:30,266

Mainly see the action

54

00:03:33,333 --> 00:03:35,433

The placement is relatively correct

55

00:03:36,866 --> 00:03:39,333

Basically, there is no such movement

56

00:03:42,133 --> 00:03:49,733

Now you can clearly see that the flux at the bottom has been squeezed out a lot, which means that the chip has been welded