1

00:00:03,133 --> 00:00:05,699

now let's start to disassemble this CPU

2

00:00:08,700 --> 00:00:10,100

use the rotary air gun

3

00:00:10,100 --> 00:00:14,000

adjust the temperature to about 300 to 320 degrees

4

00:00:14,100 --> 00:00:16,766

and the air volume is level 3 to four

5

00:00:21,133 --> 00:00:23,666

the hitting method is basically the same as the

6

00:00:23,666 --> 00:00:27,599

previous disassembly of the A8 and A9 CPU

7

00:00:28,933 --> 00:00:30,533

blow in the circle first

8

00:00:30,600 --> 00:00:33,933

then blow a little more on the upper and lower areas

9

00:00:40,600 --> 00:00:43,200

because the PCB is extended more

10

00:00:46,533 --> 00:00:48,699

the temperature absorbed by the PSP

11

00:00:48,700 --> 00:00:49,733

on the left and right

12

00:00:49,733 --> 00:00:50,733

sides is less

13

00:00:50,733 --> 00:00:53,299

than that on the upper and lower sides

14

00:00:54,133 --> 00:00:57,133

so we have to blow the upper and lower sides more

15

00:01:14,766 --> 00:01:16,733

test the edge with a knife while

16

00:01:16,733 --> 00:01:19,266

blowing to see if the team has melted

17

00:01:22,100 --> 00:01:25,166

the tin of the middle and upper area has melted

18

00:01:26,866 --> 00:01:30,133

the side closed the baseband to pude not melt

19

00:01:30,466 --> 00:01:33,733

it is because the high temperature tape is attached

20

00:01:34,733 --> 00:01:37,899

which blocks all heat on this side of the basepad

21

00:01:38,533 --> 00:01:40,899

so we have to blow this area more

22

00:01:42,700 --> 00:01:46,500

the CPU temperature after the 18 must be blown enough

23

00:01:47,266 --> 00:01:49,866

if the temperature is not enough you cannot

24

00:01:49,933 --> 00:01:51,333

directly pry it

25

00:01:51,400 --> 00:01:54,300

otherwise it will easily cause pad break off

26

00:01:59,300 --> 00:02:01,300

now the CPU has been removed