1

00:00:07,866 --> 00:00:09,766

This edge is not scraped clean,

2

00:00:09,766 --> 00:00:12,566

we have to flatten the low melt solder again

3

00:01:28,533 --> 00:01:32,666

Now, let's use the blade to scrape off the remaining glue on this edge

4

00:01:37,266 --> 00:01:39,933

Now let's clean the glue on the blade again

5

00:02:49,733 --> 00:02:52,233

Now we can remove the high temperature tape

6

00:02:55,533 --> 00:02:59,166

Then just check if the glue on the pad has been scraped clean

7

00:03:00,500 --> 00:03:03,766

You can see it clearly after removing the high temperature tape

8

00:03:14,033 --> 00:03:16,166

Ok, the pad is clean now

9

00:03:21,200 --> 00:03:23,500

Let's clean up the leftovers

10

00:04:03,033 --> 00:04:05,666

After the temperature is enough, we remove

11

00:04:05,666 --> 00:04:09,133

the rotary-air gun and continue to scrape off the leftovers

12

00:04:31,266 --> 00:04:33,800

Finally, the mainboard scraping is finished