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Hello everyone, today I will show you the welding method of power IC

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This is a mainboard of iphone 7

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Let's remove the sticker from this mask first

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Then we look at this power IC

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Inside the gaps of all the components around it

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We can see the black glue

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This chip is too close to the surrounding components

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If we use the glue-scraping method that we used to

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scrape the wifi and the hard drive before to remove it

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It's very easy to scratch the periphery of the chip

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And the surrounding small components are relatively easy to loosen

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because of the narrow gaps around them

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So, we're gonna use the same method we used to pry the non-glue chip

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to remove it directly with high temperature

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Let's go to see how to do it

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The power IC of this mainboard has 3 positions for the tweezer to get in.

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The surrounding area is relatively empty

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There's also nothing behind to get in the way of the tweezer

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And another position is here

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But it has a relatively high capacitor behind it

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We can remove the filter capacitor of the power supply of this cpu in advance

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And you can also pry by this position

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However, this resistor is likely to be touched

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and we have to remove the capacitor behind

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You can pry from these 3 positions

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But by comparison,

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this position is the first choice,

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and this position is the second choice,

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Then let's see how to disassemble

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We set the straight air gun to a temperature of 450 degrees,

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the maximum air volume

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Then blow at this position where the tweezer will get in

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Poke the tweezer under the chip

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Ok, now a small piece of the tweezer has been stuffed under the chip

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Then we can start prying

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The air gun starts heating at the center of the chip

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Pry hard with the tweezer

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Pry this chip, the force must be strong

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Otherwise, when you pry it off, the tin extrude might happen

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In this way, the power IC removal is done

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After removing it, you can take a look at these solder pads under the chip

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They are basically flat.

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Only the position where we pry through is a little rounded or we could say the tin here is melted

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In this way, it can be 100% guaranteed that the tin extrude event will not happen on the CPU,

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nor on the small components next to it.

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Once you remove a little late, the solder pads start to melt

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and the tin extrude will happen on the components,

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the, small resistors like these are likely to become loose

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they need to be reprocessed

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That would be a huge waste of time

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And there is a possibility that the cpu will be blown up

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if you remove a too late

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Because this power IC is just behind the cpu

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Therefore, we must control the temperature appropriately.

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When you pry in this position,

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Be sure to push the tweezers up firmly

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At the beginning, when the mainboard was not locked firmly,

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the head on this side curled up,

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indicating that I pried very hard.