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Next, we start to remove the residual tin on the pads of the mainboard

2

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The glue on the bottom of the chip is basically taken away by the chip,

3

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when the chip is pried off

4

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Look, this is the the thick layer of black glue

5

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However, there is still a ring of glue on the edge of the mainboard.

6

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So we can directly apply the low melst solder to the mainboard when we flatten

7

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Because the surrounding glue forms a partition,

8

00:00:35,233 --> 00:00:38,466

The middle one is lower than the surrounding area, like a pool

9

00:00:39,400 --> 00:00:41,133

When you flatten the low melt solder,

10

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even if the low melt solder flows to the periphery,

11

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it is not easy to touch the small components on the edge

12

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Can add appropriate amount of low melt solder

13

00:00:54,900 --> 00:00:56,866

Add a small amount multiple times

14

00:00:57,200 --> 00:00:58,600

Let's add a little first,

15

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and if it's not enough to flatten on the edges, we'll add a little more

16

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Don't add too much at once

17

00:01:24,666 --> 00:01:28,966

Make sure that every pad around the perimeter is flattened by the soldering iron

18

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There is a piece of copper foil stuck on the tip of the soldering iron

19

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Let's wipe it off, otherwise, it might stick to these pads

20

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A little more low melt solder

21

00:02:12,933 --> 00:02:15,066

This pcb board is of poor quality,

22

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the soldering iron did not touch the board much,

23

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and a small part began to leak copper.

24

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Like this position, the color here has also become a little lighter.

25

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Therefore, we must pay attention to our strength when we flatten

26

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This board is very easy to leak copper

27

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The tin on the edges and corners is not easy to melt,

28

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just flatten the soldering iron back and forth at different angles

29

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to make sure it is completely melted

30

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This position was flattened a little more, and the copper foil leaked out a little bit.

31

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This board is so bad

32

00:03:59,733 --> 00:04:02,700

Okay, we're done with the low melt solder on the mainboard

33

00:04:03,000 --> 00:04:05,533

Now let's flatten the low melt solder on the chip.

34

00:04:08,633 --> 00:04:11,800

We use the chip card position on the fixture to fix the chip

35

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There is very little tin remaining on the chip,

36

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because the temperature of the chip we pry is very suitable

37

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There is still a lot of low melt solder on the soldering iron,

38

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we don't need to add more

39

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There is a thick layer of glue on the chip,

40

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which separates the soldering iron and the chip.

41

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So at this time, it doesn't matter if you flatten a little more

42

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Okay, we're done with the flattening