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Next, let's deal with the black glue residue on the mainboard

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There is a lot of flux on the mainboard, it will be difficult to see

3

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Because under the microscope, the flux will be slightly reflective

4

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let's clean it

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In this case, the viewing effect will be better

6

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It's done

7

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Next we start to remove the glue on the edges

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There is basically no glue residue in the middle, mainly on the edges

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Copper leakage is easy to appear in the process of flattening,

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and it may also appear when removing glue

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Let's pay a little attention

12

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It's better to use a straight air gun,

13

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200 degrees, and the maximum air volume

14

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We gently poke it with a tweezer when the air gun blows the black glue

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It's easier to pick up once it's loose

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We have to pry up, don't poke at the mainboard

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It's fortunate that copper leakage doesn't happen on this area

18

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The temperature of 200 degrees will only soften the glue,

19

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and the tin will not react at all

20

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So we don't have to worry about loosening the small components when we remove the glue

21

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The glue in the lateral gaps of the edge should also be removed,

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to prevent the residue from hitting the chip when it is too much

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Ok, so we've completely removed all the glue from the edges