1
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Next, we start to remove the glue on the chip
2
00:00:06,466 --> 00:00:11,200
Rotary air gun, about 230 degrees, and the air volume is level 3-4
3
00:00:14,133 --> 00:00:16,000
The temperature is the same as when we
4
00:00:16,000 --> 00:00:17,966
usually remove the glue on the mainboard
5
00:00:27,800 --> 00:00:30,333
Take the rotary air gun to blow the chip first
6
00:00:30,533 --> 00:00:33,033
Blow the residual soldering tin on the pads
7
00:00:46,600 --> 00:00:49,766
The soldering tin is now clearly reflective and shiny
8
00:00:50,166 --> 00:00:51,966
It means it's in a melted state
9
00:00:52,600 --> 00:00:54,900
Then shovel with a size 4 flat blade
10
00:00:56,400 --> 00:00:59,300
Sharpen the blade a bit blunt and round the corners a bit
11
00:01:10,200 --> 00:01:12,500
Do not shovel directly with the new blade,
12
00:01:13,166 --> 00:01:16,466
otherwise, it is easy to shovel the yellow circuit board behind
13
00:02:14,900 --> 00:02:17,833
There may still be a little bit of residual tin on the chip,
14
00:02:18,166 --> 00:02:19,433
after shoveling the glue
15
00:02:20,133 --> 00:02:24,200
It is best not to use the soldering iron to press the solder wick to flatten
16
00:02:26,366 --> 00:02:28,433
Put a little soldering oil on it
17
00:02:28,533 --> 00:02:31,666
We can clearly see that there are many thin wires on it
18
00:02:33,566 --> 00:02:35,233
If you flatten too hard,
19
00:02:35,333 --> 00:02:37,800
the thin insulating layer on the surface of the thin wire
20
00:02:37,800 --> 00:02:41,100
can easily be scratched and cause a short circuit
21
00:02:42,533 --> 00:02:46,033
Let's sweep it with the used solder wick to remove the tin
22
00:02:48,066 --> 00:02:52,466
It must be used, and there is tin on it, so that it is not easy to disperse
23
00:02:57,366 --> 00:03:00,733
Set the temperature of the rotary air gun 230 degrees
24
00:03:03,800 --> 00:03:07,433
In this way, the excess tin on the surface is swept away at once.
25
00:03:32,500 --> 00:03:34,100
Okay, we're done with this chip