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Next, let's deal with the pads of the mainboard

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There are more dirty things on the edge, so don't rush to flatten it

3

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First clean up this residue or something

4

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Otherwise, after flattening, the residue will be more difficult to clean

5

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Put some soldering oil on the mainboard

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Use the solder wick to smooth all the soldering tin on the pads

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When flattening, the force must be light

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the big, unmovable spots like this one on the edge

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appeared when the low melt solder is not completely flattened through

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Dip some low melt solder on the soldering iron and flatten again

11

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Because there is a lot of glue residue at the very edge at the beginning

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When we flattened, some pads were separated by the glue

13

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The soldering iron is not easy to reach it

14

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So after this edge glue is processed,

15

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if the surrounding tin is not clean, we will flatten it again

16

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At this time, take the solder wick to absorb it, it will be easier to melt

17

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Okay, after all the pads have been flattened, let's clean it up

18

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Let's clean up the solder residue around

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Because when the glue is removed and then the low melt solder is applied,

20

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there will be some small residues.

21

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We're going to clean it up to prevent a short circuit

22

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it is now active

23

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But once heated, it may stick to the middle of the components

24

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It doesn't matter much like this position

25

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But there must be no tin paste on the top side just now.

26

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Take a look at the position of the copper leak

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If the copper leakage is a little more serious, we need to put a little green oil

28

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Like this, it doesn't really matter,

29

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because it's far away from the edge

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There is also a little copper leakage on this corner,

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but it doesn't matter.

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We have already dealt with the pads