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Let me show you how to disassemble and weld some
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small-sized adhesive chips on the mobile phone mainboard
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Let's look at the first way
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It is basically the same as the way of prying the
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power IC in our last video demonstration
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Blow it from the side with a straight air gun,
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450 degrees, the largest air volume
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The tip of the tweezer sticks to the bottom of the chip
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Then we pick it up while heating
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take this chip off it at the moment the tin melts
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In this way, there is basically no risk of the tin extrude
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in the surrounding components
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Especially as this chip is closer to the CPU
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If you blow it for a little longer,
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it is easy to blow the tin of the CPU or the
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small components around the CPU
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This is our first disassembly method
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Just choose an area with some open space around it
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where the tweezer can get in
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For example, this chip, it is not suitable for prying
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in the way we just did
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Because it is inconvenient to operate in this position,
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the tweezer is not easy to pick
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But this chip, because the space on the right side
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of it is relatively empty
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It's easier to put the tweezer
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This is the first way to disassemble
