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In the second disassembly method, we use a grinding pen to grind

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Grind the chips directly with this grinding head

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But this way of grinding is only suitable for some chips

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that can be replaced

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However, like the logic chip and NFC on the mainboard,

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they are not suitable for this disassembly method,

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because they are irreplaceable chips

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If you grind this kind of chips,

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then the board basically can't be used as it is

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So we can only grind some chips that can be replaced

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Now let's see how to disassemble

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Use a grinding pen to grind directly on the surface of this chip

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Don't press too hard when grinding, just rub it lightly on the surface

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Pay attention to the small capacitors around,

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try not to touch them

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It would be better if the grinding head was smaller.

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If there is a lot of debris, we sweep it away,

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prevent from blocking our view

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sweep it again

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Like this area in the middle, we can see the regular little dots

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When we see this kind of dot, we don't need to continue grinding down,

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because it has been polished to the depth we need

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Otherwise, it is easy to damage the mainboard

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Change the angle

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It's basically done

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This position in the upper left corner needs to be grinded again

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As well as this corner

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All pads should be visible

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Ok, now we can basically see all the pads of the chip

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which means it has been completed