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After reading the three different disassembly methods,

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let's take a look at how to deal with the pads

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and residual tin on the mainboard

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Let's apply a little flux first

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Stick some low melt solder on the tip of the soldering iron

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flatten all the pads on the mainboard

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The mainboard made by this manufacturer is relatively poor.

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I flattened a little, and there was a idle pad broke off

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Where there is glue on the edge, the pad is not easy to melt

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We can use the air gun to assist, it's better to flatten

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Straight air gun, the temperature is 150-200 degrees

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Especially for such a small chip,

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it can only fit the tip of the soldering iron,

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and there are many pads that cannot be flattened

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If there is temperature to assist, it will be better to flatten

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Okay, we've finished flattening this position,

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and then let's flaten the other two positions

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At a temperature of 200 degrees,

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the tin extrude won't happen on the components

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It's a little hard to flatten this position,

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because there are still some residual glass crystals on the edge

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The tip of the soldering iron is not easy to stick on the tin, let's wipe it

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Generally, there are more grounded pads on the corners of the chip.

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When you flatten these corners,

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if there is no air gun to assist, there is no response at all

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For example, like this corner

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We have to take the air gun to assist,

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and slowly flatten it a few times

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Then It melted right away