1

00:00:02,700 --> 00:00:04,900

After the tin flattening is completed,

2

00:00:04,900 --> 00:00:08,700

we will start to clean up the residual black glue around the pads

3

00:00:14,766 --> 00:00:18,700

Rotary air gun, 200 degrees, and a large air volume

4

00:00:32,066 --> 00:00:35,400

Soften the black glue and gently push it with a tweezer

5

00:00:44,733 --> 00:00:46,166

The temperature is suitable,

6

00:00:46,333 --> 00:00:48,600

It doesn't matter if you blow a little longer

7

00:00:48,733 --> 00:00:51,000

we don't need to worry about the tin extrude

8

00:00:52,766 --> 00:00:55,933

Only the low melt solder remaining on the pad will melt

9

00:01:46,000 --> 00:01:48,766

A small component may have been removed by the

10

00:01:48,766 --> 00:01:50,633

soldering iron when flattening the tin,

11

00:01:50,833 --> 00:01:53,100

or maybe it loosened when the tin extruded

12

00:02:00,766 --> 00:02:03,966

Let's find a board of the same model to compare it later

13

00:02:05,333 --> 00:02:06,733

Let's look at this area

14

00:02:20,133 --> 00:02:22,400

Blow for a while and then start poking

15

00:02:23,300 --> 00:02:26,100

Because the glue is hard, it is not easy to handle

16

00:03:15,066 --> 00:03:16,366

A few pads broke off

17

00:03:17,733 --> 00:03:20,033

Let's see if they're idle pads later

18

00:03:42,100 --> 00:03:45,700

When removing glue, be careful not to sharpen the tip of the tweezer

19

00:03:46,933 --> 00:03:49,633

Otherwise, it is easy to damage the mainboard

20

00:04:46,700 --> 00:04:49,300

Okay, we're basically done with this glue