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In this lesson, we're going to talk about the chip location recognition
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What we see now is the component map of the mainboard
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The component map of the mainboard is actually the identification or description
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of the main chips in the mainboard
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For example, in this mainboard,
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here is the Snapdragon 845 CPU
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Here is Samsung's font library,
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and these positions show the chips, audio chip,
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gravity sensor chip,
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fast charging chip, audio power amplifier,
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RF power amplifier, etc.
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Ok, let's talk about these chips separately
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Let's take a look at the CPU
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The CPU is the central processing unit
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The most important thing in a smart phone with good performance is the CPU
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It is the control center system of the mobile phone
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and the control center of the logic part
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Here is the CPU
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The picture on the right is the CPU of Qualcomm SM6150
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At present, the mainstream chip manufacturers for smartphones are those shown in the picture on the right
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Qualcomm, MediaTek, Hisilicon and Samsung
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Let's take a look
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Qualcomm
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The first row is the branding of Qualcomm processors
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Second row, SDM670 is the model
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MTK
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The first row is MediaTek logo
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The second row, the string begins with MT is the model of this CPU
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Hisilicon
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Hisilicon's CPU starts with Hi
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Hi6280 is the model of this CPU
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Samsung
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This is the Samsung's logo,
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980 refers to the model of this CPU
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Ok, let's take a look at the structure of the CPU
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The current CPU adopts double-layer welding,
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and the welding method is double-layer
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For example, in the picture on the right,
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it looks like a hamburger
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The top of the double-layer CPU is the temporary storage
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The codes engraved on its surface are the temporary storage models
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Only when the temporary storage is removed can we see the CPU model
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This structure of upper and lower layers
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we call it PoP structure, package stacking technology
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Laminate, stack up, that's what it means
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Well, this picture shows the CPU
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after removing the upper temporary memory chip
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This is the back of the CPU,
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SM8150 is the model of this CPU
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OK, that's it for the lesson of the CPU