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iPhone audio circuit repairing

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This video mainly explains the iPhone audio architecture

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The audio architecture block diagram refers to the chips and connectors involved in the audio circuit

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Different chips in the architecture diagram have different functions,

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and the signals connected to different connectors are also different

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Let's first check the audio block diagram from iPhone7 to iPhone 11 ProMax

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The chips and connectors of these models are the same

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In the block diagram, the big audio is mainly responsible for converting analog signals into digital signals,

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or converting digital signals into analog signals

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Because in the audio circuit, the voice signal is an analog signal

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When the CPU processes audio signals, it can only process digital signals,

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so it needs a large audio frequency to convert

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The main function of the CPU in the audio circuit is

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to forward the digital voice signal of the large audio input to different chips

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In the audio circuit, the hard disk is mainly used to store voice data

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The baseband is mainly responsible for transmitting and receiving voice signals when making a call

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The earpiece power amplifier and speaker power amplifier are mainly used to

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convert the sound signal when answering the phone or playing songs

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The audio circuit of the iPhone is divided into two main lines,

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which are the line for receiving voice and the line for emitting sound

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There are 4 microphones for receiving voice on the iPhone, from MIC1 to MIC4

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Different microphones will be responsible for the voice reception of different functional circuits

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MIC 1 and MIC 4 are connected to the cable of the charge connector,

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and the signal is transmitted to the large audio through the charge connector

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MIC1 is mainly responsible for receiving voice signals when making calls

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MIC4 is mainly responsible for receiving the voice signal after hands-free when making calls

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MIC2 will be connected to the big audio through the boot cable socket,

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mainly used to collect sound when the rear camera records video

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MIC3 will be connected to the big audio through the earpiece connector

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MIC3 is located on the earpiece cable and is mainly responsible for

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collecting sound when the front camera records video

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Let's look at the signal from the iPhone

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The speaker of the earpiece is connected to the earpiece cable,

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and connected to the earpiece amplifier through the earpiece connector

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The speaker at the bottom will be connected to the charge cable,

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and connected to the speaker power amplifier chip through the charge connector

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The sound signal is mainly controlled by the earpiece power amplifier and the speaker power amplifier

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The earpiece amplifier is mainly responsible for the sound from the speaker on the top of the phone

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The speaker amplifier is mainly responsible for the sound from the speaker at the bottom of the phone

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When we play a song, the earpiece amplifier and the speaker amplifier

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will simultaneously send voice data to the speaker

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After the speaker receives voice data, it will emit sound at the same time

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In the block diagram, the line from the big audio to the CPU is the I2S or ASP bus,

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which is mainly used to transmit the digital audio signal from the big audio to the CPU

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The PCIE bus from the CPU to the hard disk is mainly used to transmit audio data from the CPU to the hard disk

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The I2S bus from the CPU to the baseband is mainly used to transmit voice data when making calls

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Let's look at the audio circuit block diagram of the 12 series

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12 series audio circuit block diagram is the same as that of 7-11 series

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The only difference is that MIC2 will be connected to the flash connector,

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it is not connected to the power socket

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All other signals are the same

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That's all for this video