1

00:00:03,500 --> 00:00:05,666

Now we start layering

2

00:00:06,733 --> 00:00:11,300

Wait for the temperature to reach the 230 degrees we set

3

00:00:38,033 --> 00:00:41,700

Since the temperature of the heating table is relatively high,

4

00:00:42,200 --> 00:00:47,566

we put a thermal insulation pad on the bottom to prevent the table from being damaged

5

00:02:04,200 --> 00:02:07,833

Now the temperature is close to the temperature we set

6

00:02:08,400 --> 00:02:14,433

Due to the different operating environment, the mainboard may have some more or less deformation

7

00:02:16,366 --> 00:02:18,800

Because of the touching with the aluminum block,

8

00:02:18,800 --> 00:02:23,633

sometimes it will melt a little faster, sometimes it will melt a little slower

9

00:02:24,600 --> 00:02:31,100

Now the temperature is close to 230 degrees, we can test it to see if the solder has melted

10

00:02:31,600 --> 00:02:34,833

Use a tool to press the lower layer of the mainboard,

11

00:02:34,833 --> 00:02:38,700

and then push the upper layer of the mainboard to see if it will move

12

00:02:39,100 --> 00:02:42,433

If it doesn't move, we'll heat it up a bit more

13

00:02:42,833 --> 00:02:46,733

There is no reaction yet, heat it up for a while

14

00:02:57,366 --> 00:03:00,933

In this process, we must continue to test

15

00:03:12,233 --> 00:03:14,500

now it's basically loose

16

00:03:15,100 --> 00:03:20,000

Hold the lower layer with a screwdriver and lift it up vertically with a tweezer

17

00:03:22,100 --> 00:03:26,566

This side doesn't seem to be loose yet, let's reheat it a little bit

18

00:03:30,833 --> 00:03:33,700

Because the bottom of the board is slightly deformed,

19

00:03:34,066 --> 00:03:37,100

if some parts are touched, the heating will be faster,

20

00:03:37,433 --> 00:03:40,733

and if some parts are not touched, it will be slower

21

00:03:54,000 --> 00:03:56,433

ok now it is separated

22

00:03:58,400 --> 00:04:00,800

Then we turn off the heating stage