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When we repair this kind of double-layer mainboard, we rarely plant the solder on the middle frame

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Generally, after the mainboard is divided into layers,

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we go to find the internal faults of the mainboard

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After troubleshooting, we use a dedicated test stand to test the function

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After the function test is normal, we directly use the original solder to paste it back

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In this way, the solder points will be very stable and easy to paste

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I am now demonstrating to replant the solder

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To replant the solder, we need to level the residual solder on the middle frame

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We'd better operate on this heating table

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Because there is still some residual temperature on the heating table,

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in this way, the solder will be relatively easy to drag during the dragging process

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First add a little solder paste to the solder points

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Then use a soldering iron to match this suction line, and flatten all the solder points to it

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Why is the original solder paint easy to fit?

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Because a pad will be placed on this solder point, the pad can play a supporting role

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In the process of bonding, basically there will be no short circuit

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If the tin planting is not good, there may be a short circuit

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We can see that there are some solders on the solder suction line,

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similar to when we make glueless chips or CPUs

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When dragging the tin, the empty spot on the main board, the round metal piece,

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is basically the same size as this solder point.

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This is placed in the middle of the upper and lower layers to play a supporting role

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We glued this mainboard

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You can apply some pressure from above, it's not easy to short circuit

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However, if the size of the tin implants is uneven, or the solder points are relatively large,

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short circuits are prone to occur.

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Therefore, it is not recommended to replant tin unless there are some dropped spots on the upper mainboard.

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For example, if there is a drop point at this edge position, we will make up the point

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After finishing, there may be some unevenness

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We can drag the solder points down and re-solder

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Under normal circumstances, we generally do not replant tin

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I can't see clearly because I don't use a microscope

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There is that kind of small gasket dragged down from the solder suction line

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I don't know if it can be focused

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Have a look

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It is very easy to drag tin on this heating table

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Because there is residual heat at the bottom, there is no need to mop it very clean

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When we planting the tin, as long as the tin on the solder point is not too high, it doesn't matter

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In the process of dragging tin, pay attention to this aluminum block,

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be careful not to burn your hands, because it has more than 200 degrees

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Well, all the solder points are basically leveled out