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138. Upper mainboard solder point flattening 2
138. Upper mainboard solder point flattening 2
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1

00:00:03,100 --> 00:00:05,800

Cut off the solder wick used before

2

00:00:06,466 --> 00:00:10,000

It's better to stack the solder wick into double layers,

3

00:00:10,833 --> 00:00:13,166

that is, to bend the front section to it,

4

00:00:13,200 --> 00:00:16,566

which is more useful, and when pressing with a soldering iron,

5

00:00:16,566 --> 00:00:18,766

it is not easy to be too strong

6

00:00:25,533 --> 00:00:32,400

If it is a single layer, it is easy to drag and leak copper on the motherboard if the strength is not well grasped

7

00:00:43,833 --> 00:00:46,566

When dragging, don't go too fast

8

00:00:48,033 --> 00:00:51,333

If the speed is too fast, there will be some residue,

9

00:00:51,366 --> 00:00:54,166

because some tin has not been fully melted

10

00:00:54,766 --> 00:00:57,366

But a little bit doesn't matter much

11

00:01:01,366 --> 00:01:04,266

Let's smooth it out as much as possible

12

00:01:10,300 --> 00:01:14,933

Be careful not to bruise or knock off the small components next to it

13

00:01:18,533 --> 00:01:23,966

The corners are not easy to drag, just hold down the soldering iron and stay for a while

14

00:02:42,933 --> 00:02:47,566

There is a lot of tin on the tin suction line, let's cut it off a little

15

00:04:28,533 --> 00:04:32,633

Cut off the part that is too thick and make it a single layer

16

00:04:34,766 --> 00:04:39,366

When dragging a single layer, pay attention to the strength of the soldering iron,

17

00:04:39,366 --> 00:04:40,700

don't be too heavy

18

00:04:45,700 --> 00:04:49,066

In this way, all the solder joints are flattened

19

00:04:49,933 --> 00:04:56,100

Don't rush to clean it at this time, because there may be solder oil on the solder joints, which is dirty

20

00:04:56,700 --> 00:05:00,000

We have dragged low-temperature tin for each solder joint,

21

00:05:00,000 --> 00:05:03,466

and low-temperature tin is very easy to oxidize

22

00:05:04,033 --> 00:05:09,766

Clean it when we are ready to fit, otherwise the solder joints will be oxidized and blackened

23

00:05:10,300 --> 00:05:13,400

When the middle frame is tinned, even if it is melted,

24

00:05:13,400 --> 00:05:15,633

it may not be able to stick to it

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