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Next, we tin plant the middle frame

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First of all, clean the residual solder paste after dragging the tin just now,

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and use a dust-free cloth dipped in board washing water to clean it

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If there is too much solder paste remaining,

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the tin beads will easily spread out towards the periphery when the tin is planted

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Because there is too much solder paste, the solder paste is diluted after it goes to the top

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After the solder paste melts, it is like water,

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it will wash away the tin powder in the solder paste

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So the pad must be wiped clean

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Then observe under the microscope to see if there are solder points connected by small pads when tinning

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OK, after wiping it down, let's get the stencil

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Underneath is a special tin planting fixture for the iPhone 13 series

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It supports iPhone 13, 13Pro, 13 Promax, and 13 Mini models

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There is a magnet underneath

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After the mainboard is put on, put the stencil on it

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After the alignment is stable, a white dot can be seen under each hole,

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which means alignment

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If it is not aligned, you will see the hole is black

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The reballing stencil should be cleaned in advance

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After the stencil is stabilized, start to apply tin paste to the hole

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The iPhone 13 series uses medium-temperature tin, 183 degrees

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There is also a 181 degree, containing silver, the strength will be better

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Both can be used

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Wipe the tin paste as much as possible, do not wipe it repeatedly

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Let's touch up the places that haven't been wiped,

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and don't wipe the places that have been wiped

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Then remove excess solder

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Wipe off residual solder with a dust-free cloth

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The dust-free cloth actually has another function,

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which is to press the solder onto the middle frame to make it stick firmly

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Because the stencil will be removed later, there is no way to blow it with the stencil

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Now we slowly peel off the stencil

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In this way, we have already applied the solder paste to the solder points

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Then we heat it up and blow the solder