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141. Secondary tin plant in middle frame
141. Secondary tin plant in middle frame
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1

00:00:02,333 --> 00:00:06,100

Sometimes, the tin planting may not be full at the first time,

2

00:00:06,100 --> 00:00:07,866

we can add another layer

3

00:00:17,466 --> 00:00:21,200

Some places where the tin was not painted very well just now,

4

00:00:21,700 --> 00:00:24,066

in this case, we can replant it

5

00:00:33,300 --> 00:00:38,200

If it is planted twice, the solder points will be more uniform and fuller

6

00:02:41,266 --> 00:02:44,566

Then check to see if there is any blockage in the hole.

7

00:02:45,200 --> 00:02:49,300

If there is a blockage, it means that the tin has not fallen

8

00:02:50,233 --> 00:02:51,266

Blow it

9

00:03:17,966 --> 00:03:22,333

You can also put the mainboard directly on the layered heating table to heat it,

10

00:03:22,733 --> 00:03:25,033

and the tin will be easier to melt

11

00:03:30,066 --> 00:03:33,000

Sometimes the temperature is not well controlled,

12

00:03:33,000 --> 00:03:36,300

and some parts of the bottom may be blown out of the tin

13

00:03:46,633 --> 00:03:52,733

After planting tin twice, it can ensure that each solder point is 100% planted

14

00:03:53,500 --> 00:03:57,033

Moreover, this way the solder points will be fuller

15

00:03:59,266 --> 00:04:01,633

Tin planting is now complete

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