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Hello everyone, let me show you how to remove the fully enclosed shield

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on the mainboard of the new iPhone model

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This kind of shield is directly punched out of a metal sheet, there are no small holes around it,

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you can use tweezers to pry it

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We want to disassemble this shield, we can only pry it up from the side

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But this will be more difficult to operate,

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if the strength is small, it will not be able to pry it up

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If the force is too strong, you may accidentally poke the tweezers into it,

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and it is easy to poke the components

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Therefore, before removing this shield, we need to drill a hole with a grinding pen at the four corners or edges

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Therefore, before removing this shield, we need to drill a hole with a grinding pen at the four corners or edges

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Then slowly pry it up from the hole

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Like the iPhone 13 I am going to disassemble now,

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the shield of this mainboard is on the back of the CPU

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Here is the shield, and the other side is the CPU

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The corner on this side of the interface will be slightly farther away from the CPU

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We choose an area farther away from the CPU to pry

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Because when prying, we have to blow for a long time, and the temperature will be relatively high

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If you blow it at the position directly behind the CPU, it may blow the CPU

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So we choose the corner a little farther away from the CPU

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For example, the area in the lower right corner, it will be safer to pry from this position

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Let's use a grinding pen to make a small hole in this corner now,

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and use the tweezers when disassembling

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The hole does not need to be ground too large

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Next, we use the air gun to disassemble

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To disassemble this shield, we try to use a straight air gun

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Because it is soldered to the mainboard with high temperature tin

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If the rotating wind is used to blow, the heated area is too large,

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and the risk is particularly great

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So we choose to use a straight air gun to heat a small area

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Now take the tweezers from this place in the lower right corner

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I'll blow the bottom side and the right side first

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Adjust the direction a little bit to make it easier to operate

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We choose the temperature of 450 degrees, the maximum air volume

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I use a 957 air gun equipped with an 8 mm diameter air nozzle

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The bigger the nozzle, the faster the removal speed

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At the same temperature, if you use a small nozzle to blow, it will be slower

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Ok so this side is up

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Then adjust the direction a little bit, and then blow other areas

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Left, right and bottom parts are loose

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let's blow on it

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In this way, it will be uncovered

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After taking it off, let's take a look at the solder on the edge

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The positions of the solder points are relatively flat

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If the solder is completely melted, the power IC at the bottom of the shield will be easily blown off

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Ok, this shield removal is now demonstrated