1

00:00:03,000 --> 00:00:05,633

Next we start to remove the glue

2

00:00:09,300 --> 00:00:11,200

Let's get some low-temperature tin first

3

00:00:12,833 --> 00:00:15,500

Drag the solder joints of the mainboard and the solder joints of the chip

4

00:01:16,733 --> 00:01:21,166

After the low-temperature tin is dragged, we will start to scrape the glue

5

00:01:21,700 --> 00:01:26,266

These steps are not much different from the previous steps

6

00:01:26,900 --> 00:01:34,700

The temperature is about 230 degrees, and the heating is started on the area that needs to be scraped

7

00:01:35,800 --> 00:01:40,700

While heating, take a squeegee and gently test it to see when the tin melts

8

00:01:41,066 --> 00:01:44,300

The tin is now visibly melted and flat with a scrape

9

00:01:44,700 --> 00:01:46,200

We can shave now

10

00:03:37,633 --> 00:03:39,433

The mainboard has been scraped clean

11

00:03:39,900 --> 00:03:41,266

Next we scrape off the chip

12

00:03:55,666 --> 00:03:58,700

The temperature is the same, 230 degrees

13

00:05:01,000 --> 00:05:05,900

After scraping clean, next we start dragging the solder joints

14

00:05:16,233 --> 00:05:19,266

We also drag the solder joints on the mainboard

15

00:06:04,033 --> 00:06:11,466

Ok, the solder joints and the glue on the chip have all been processed