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Hello everyone, today I will show you how to solder the double-layer CPU of the HiSilicon series.

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Let's scrape the heat dissipation silicone grease on the surface of the CPU with a blade

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After most of the scraping is over, we use a lint-free cloth with some washing water to clean it

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Next, we will scrape the edge of this chip

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Use a rotary air gun, adjust the temperature to 200 degrees, and adjust the air volume to the maximum

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A straight air gun is fine too, and the temperature is the same

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After the edge glue is scraped, we use tweezers to scrape a trace here and mark the direction

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The marking point of pin 1 is at this position

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Then we use tweezers to make a mark on the corresponding corner

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Find this copper-clad position to scratch

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Don't draw the one with lines

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After the position is marked, we next disassemble the inductor

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Then it's convenient for us to go to the knife

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Because there are components on these four sides

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After removing the inductance, it is convenient for us to put the blade

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It's better to operate in this position

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Straight air gun 450 degrees, the largest air volume

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The inductance at this position can also be removed, which is convenient for us to operate

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This is moving, take it off together

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Ok, we have already dealt with the previous