1

00:00:03,833 --> 00:00:07,466

Next we're ready to start prying

2

00:00:09,733 --> 00:00:15,100

Use a rotary air gun, adjust the temperature to about 200-230

3

00:00:17,466 --> 00:00:18,766

Warm up the CPU first

4

00:00:20,200 --> 00:00:26,000

For a double-layer CPU like Android, the upper cover is particularly prone to problems.

5

00:00:26,233 --> 00:00:31,433

If the temperature is not suitable, or the strength of prying is not suitable,

6

00:00:31,600 --> 00:00:34,600

it is easy to break the top cover

7

00:00:34,966 --> 00:00:39,466

So let's preheat it a little bit, about 2 minutes

8

00:01:58,233 --> 00:02:01,166

Then we raise the temperature to 340 degrees

9

00:02:11,766 --> 00:02:15,933

Android's dual-layer CPU is different from iPhone's dual-layer CPU

10

00:02:16,766 --> 00:02:21,066

iPhone double-layer CPU, the old model is delaminated after being removed

11

00:02:21,066 --> 00:02:22,933

The new one doesn't need layering

12

00:02:23,466 --> 00:02:28,000

Android's double-layer CPU, we all pry off the top cover first

13

00:02:46,333 --> 00:02:49,266

Insert the blade flat and face inward, try not to pry it

14

00:03:03,400 --> 00:03:05,333

OK, so the top cover will be removed.

15

00:03:05,400 --> 00:03:06,966

Next we pry the lower layer

16

00:03:34,600 --> 00:03:38,000

For such a large chip, we try not to pry it

17

00:03:38,466 --> 00:03:42,600

It's all about poking in and letting it loosen by itself.

18

00:03:47,266 --> 00:03:51,400

Ok, we have already pried off the CPU and the top cover