1

00:00:02,933 --> 00:00:11,066

Next, we de-glue the mainboard and chip

2

00:00:11,433 --> 00:00:21,333

Make a little low-temperature tin, add some solder paste

3

00:01:47,866 --> 00:01:51,233

There is no solder paste in this area, the tin will not move

4

00:02:13,466 --> 00:02:15,766

We have finished flattening the mainboard

5

00:02:16,133 --> 00:02:17,766

Next we flatten the chip

6

00:03:57,666 --> 00:03:59,766

Add some solder paste on the chip

7

00:04:00,400 --> 00:04:04,700

Because there is a lot of glue on it, many areas are not easy to drag

8

00:04:10,833 --> 00:04:12,766

After dragging the side with more solder joints,

9

00:04:13,100 --> 00:04:17,233

we turn it over and drag the position of the middle layer to it