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161. Android CPU welding- Solder points cleaning
161. Android CPU welding- Solder points cleaning
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1

00:00:03,000 --> 00:00:06,733

Next, let's clean up the mainboard and chips

2

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Before cleaning, let's drag some tin over the solder joints

3

00:00:10,766 --> 00:00:15,066

Otherwise, after cleaning, it is very easy to oxidize

4

00:00:22,833 --> 00:00:25,233

In this way, it is not easy to pull off when cleaning.

5

00:00:25,433 --> 00:00:28,800

If there is a little tin on some solder points, when cleaning,

6

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the lint-free cloth may pull the solder points off

7

00:01:42,833 --> 00:01:45,533

We also drag some tin on the chip

8

00:01:54,600 --> 00:01:59,033

Part of the solder points on the chip may be oxidized, so it may not be easy to tin

9

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If it is not easy to tin, do not drag it forcibly, otherwise it may drag and leak copper

10

00:02:09,033 --> 00:02:12,000

And then, don't flatten too long

11

00:02:12,500 --> 00:02:15,800

Flattening for too long is easy to burn the chip

12

00:03:10,233 --> 00:03:13,433

It's almost done

13

00:03:14,166 --> 00:03:23,333

Let's wipe these dirty things first and then clean them

14

00:04:21,266 --> 00:04:26,900

Next we start to clean the mainboard and chips

15

00:06:38,366 --> 00:06:42,866

Well, the mainboard and chip are basically cleaned up

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